Call for Papers

You can view or download the call for papers here.
Research topics of interest include, but are not limited to:

Track 1:

EDA: new algorithms and tools for synthesis and verification.

Track 2:

Analog, mixed-signal, and sensor architectures.

Track 3:

Digital architectures: NoC, multi- and many-core, hybrid, and reconfigurable.

Track 4:

Prototyping, verification, modeling, and simulation.

Track 5:

Circuits and systems for signal processing and communications.

Track 6:

IoT, embedded and cyberphysical systems: Architecture, design, and software.

Track 7:

Low-power and thermal-aware IC design.

Track 8:

Emerging technologies and computing paradigms.

Track 9:

Variability, reliability, and test.

Track 10:

Hardware security.

Track 11:

Machine learning for SoC design and for electronic design automation.

Author's Guidelines


Papers should present original research and industrial results not published or submitted for publication in other forums. Electronic submission in PDF format to the VLSI-SOC 2019 (TBD) website is required. The proceedings will be published by IEEE and will be made available through IEEE Xplore. A selection of the conference best papers will be invited to submit an extended version to be included as chapters of a book to be published by Springer.


Papers should not exceed 6 pages (single-spaced, 2 columns, 10pt font). Submissions should be camera-ready, following the IEEE proceedings specifications located at IEEE website.


Papers will be accepted for regular or poster presentation at the conference. Every accepted paper MUST have at least one author registered at the conference by the time the camera-ready paper is submitted; author is also expected to attend the conference and present the paper. A limited number of travel grants are available to needy PhD students from emerging countries. Please see the web site for more information.


Abstract Submission: April 18, 2019
Special Session Proposal: April 18, 2019
Paper Submission: April 25, 2019
Notification of Acceptance: June 18, 2019
Camera-ready: July 10, 2019